MediaTek has introduced its new solution to bring artificial intelligence (AI) capabilities to smartphones, and is gearing up for competition in the AI smartphone field.

AI will become an important smartphone feature, according to TL Lee, head of MediaTek’s wireless communication product business unit. Mobile SoC developers are all looking to promote their new AI solutions in the almost saturated smartphone market.

MediaTek is scheduled to enter mass shipments of its recently-introduced Helio P60 series starting April, said Lee. The new AI-enabled chip will play a key role in improving the company’s gross margin and profit performance.

MediaTek’s Helio P60 is an enhanced version of its previous-generation P40 series, Lee indicated. The company’s R&D team developed the new P60 chips based on the P40 chip architecture, with the former having an upgrade in overall performance.

MediaTek has shifted its R&D focus to the Helio P-series SoCs for mid-range and higher mid-range mobile devices since 2017. Development of the AI-enabled P60 chip was to respond to customer demand, which is crucial for the competitiveness of MediaTek’s Helio P series, Lee noted.

AI chips are going to play a main part in MediaTek’s mobile SoC portfolio for 2018, according to Lee. MediaTek already has its in-house developed AI technology platform dubbed NeuroPilot, and will be developing multi-core solutions specifically based on its AI technology.

In addition, Lee expects the global smartphone market to register flat or slight growth in 2018. According to IDC, worldwide smartphone shipments experienced their first annual decline in 2017.

During 2018, China’s smartphone market will be following seasonal trends whereas emerging markets will continue to grow thanks to replacement purchases, Lee said.

MediaTek has seen sluggish orders for smartphones in the first quarter of 2018, but orders are expected to pick up in the second quarter, according to Lee.

TL Lee, head of MediaTek’s wireless communication product business unit
Photo: Digitimes file photo

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Author;  Jessie Shen
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